N,N-Diglycidyl-4-glycidyloxyaniline CAS 5026-74-4
N,N-Diglycidyl-4-glycidyloxyaniline CAS 5026-74-4
N,N-Diglycidyl-4-glycidyloxyaniline CAS 5026-74-4
N,N-Diglycidyl-4-glycidyloxyaniline CAS 5026-74-4
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  • N,N-Diglycidyl-4-glycidyloxyaniline CAS 5026-74-4
  • N,N-Diglycidyl-4-glycidyloxyaniline CAS 5026-74-4
  • N,N-Diglycidyl-4-glycidyloxyaniline CAS 5026-74-4
  • N,N-Diglycidyl-4-glycidyloxyaniline CAS 5026-74-4

N,N-Diglycidyl-4-glycidyloxyaniline CAS 5026-74-4


Product Description

Molecular Formula: C15H19NO4 Molecular Weight:277.32 EINECS: 275-662-9 Package: 5kg / 20kg / 200 kg Worldwide Delivery Made in China

Product Details


Introduction 

N,N-Diglycidyl-4-glycidyloxyaniline is a trifunctional, high temperature resistant, low viscosity epoxy resin. The epoxy resin has multiple epoxy groups and aromatic rings in its molecular structure, which can form a relatively high cross-linking density and aromatic density during the curing process, so that the cured product exhibits good heat resistance, high mechanical strength, low shrinkage rate, good radiation resistance, water resistance and chemical resistance. In addition, due to its low dry viscosity, it is easy to extract and can be operated without solvent. It is used for electrical casting insulation products with high heat resistance requirements, carbon fiber and glass fiber winding, pultrusion, lamination, prepreg process forming composite products, and the glass transition temperature exceeds 200°C.

 

Product Features

Low viscosity, good processing technology;
Good mechanical strength and durability;
Good chemical corrosion resistance;
Good long-term high temperature resistance;
Curing shrinkage rate;  

 

Specification:

 KT3101KT3102

Appearance

Yellow to Red Brown Viscous Liquid

Pale Yellow Liquid

Epoxy Value (mol/100g)

0.91 ~ 1.00

0.95 ~ 1.06

Epoxy Equivalent (g/mol)

100 ~ 111

94 ~ 105
APHA Color (Hazen)≤11≤5

Viscosity (mPa.s/25°C)

1500 ~ 5000

550 ~ 850

Hydrolyzed Chlorine (ppm)

≤2000

≤2000
Volatile(%)≤1.0≤0.6

Application 

High temperature resistant structural adhesives;
Pultrusion, winding and forming carbon fiber and glass fiber composite materials;
Heat resistant epoxy resin casting materials for vacuum casting (RTM, VARTM) and automatic pressure gel (APG) processes;
Pouring and sealing of micro motor components;
Electrical insulation materials;
High temperature epoxy diluents;

carbon fiber glass fiber composite materials

 

 

Pure resin casting properties:
Using DDS (diaminodiphenyl) as a curing agent, some properties of KT3101 and KT3102 epoxy resin castings were tested.
Casting preparation: Heat DDS to 200℃ (melting point 176℃) to melt, preheat the epoxy resin to 100℃; slowly add DDS to the epoxy resin, stir evenly, vacuum degas for 15 minutes, pour into the mold, and heat to form. The performance indicators of the resulting casting are shown in the following table:

 Tensile Strength (Mpa)Tensile modulus (Gpa)Bending strength (Mpa)Bending modulus (Gpa)Enlongation at break (%)Tg (DMA)℃
KT3101643.81323.52.3245-250
KT3102703.61363.42.8260-270

Ratio: Resin/DDS/C2H5NH2·BF3 = 100/48/0.95

Curing conditions:80℃/0.5h+100℃/1h+120℃/1.5h+180℃/2h

 

KT3101 and methyltetrahydrophthalic anhydride (MTHPA) casting performance:
KT3101 epoxy resin is often used in combination with aromatic amines (diaminodiphenyl, diaminodiphenylmethane, etc.) and acid anhydride curing agents (methylnadic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, etc.).
The casting performance of KT3101 and methyltetrahydrophthalic anhydride (MTHPA) (25°C) is shown in the table below:

Tensile Strength (Mpa)Bending strength (Mpa)Impact Strength (Kj/m2)Enlongation at break (%)Tg (DSC)℃
20-3090-1008-101.5-2.5190-200

Ratio: Resin/MTHPA = 100/150

Curing conditions:80℃/2h+100℃/2h+130℃/2h+180℃/3h

 

 

 

Keyword:

CAS 71604-74-5

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