Epoxy Modified Polysilazane
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Product Description
Product Details
Introduction and Application
This product uses polysilazane as the main film-forming substance, and is matched with epoxy resin, and also contains a small amount of additives such as diluent, retarder, leveling agent, etc. The film layer has high pencil hardness and yellowing resistance, and is suitable for high-temperature bonding, road and bridge construction bonding, weather-resistant anti-corrosion coatings, insulation and heat-resistant electrical components, mechanical protective coatings, etc. After curing, it forms a covalent bond with the substrate, and in a chemically bonded manner, greatly improving the mechanical strength of the adhesive layer.
Specification:
| Appearance | Transparent to semi-transparent light white liquid |
| Solid content | ＞65% |
| Density (g/mL) | 1.00±0.02 |
| hardness | ≥6H |
| Adhesion | 0 class |
| Salt spray resistance | ＞500h |
| Hydrophobic Angle | ≥105° |
| Artificial aging resistance | 3d No rust, no powdering, no cracking, slight discoloration |
| Dielectric strength (V/mm) | ≥10*5 |
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