Improvement of Heat Resistance and Formulations of Epoxy Adhesives
2026-04-30
The usual operating temperature of epoxy adhesives is between -60° and 150°C, the long-term reliable operating temperature being below 100°C. In recent years, with the development of science and technology, higher requirements have been placed on the heat resistance of epoxy adhesives: it must be above 250 °C, with short-term heat resistance at 500 °C. Two factors influence the heat resistance of epoxy adhesives: on the one hand, the heat-mold resistance temperature of the cured material and, on the other, its thermal oxidation stability. The higher the crosslinking density of the cured material and the more heat-resistant groups, such as aromatic rings, it contains, the better the heat resistance. This is determined by the molecular structure of the epoxy resin and the curing agent and can be regulated at the same time by the addition of modifiers.
High-Temperature Resistant Epoxy Resins
Increasing the crosslinking density is one of the most important measures to improve the heat resistance of epoxy resin adhesives. By increasing the functional groups of the epoxy resin, the heat mold resistance temperature can be increased, and thus the high-temperature resistance of the adhesive can be improved. Epoxide resins, or epoxy, with high functionality include phenol epoxy, benzophenone, naphthalene epoxy, resorcinol, and diphenylamine epoxy resins.
Silicone-Modified Epoxy Resins
A phenolic epoxy resin modified with methyl phenyl silicone resin, combined with boron phenolic resin and curing accelerator, and filled with nano montmorillonite, can be prepared as an epoxy adhesive with a shear strength of 12.3 MPa at 300 °C. The organosilicon-modified epoxy resin adhesive prepared by graft copolymerization has high heat resistance and adhesive properties and can be used as a potting adhesive.
Heat-Resistant Curing Agents
This type of curing agent can be divided into two categories: on the one hand, aromatic amines and modified amines; on the other hand, aromatic anhydrides with several functional groups. Common heat-resistant hardeners are MPDA, DDM, DDE (4,4'-diaminodiphenyl ether), DDS, methylcyclohexylamine, acrylamide hardeners (BDPIS), diazone (DHPZ), fluorodeniamine hardeners, terephthalic acid anhydride, phenylketonetracarboxylic acid anhydride, methylenedicinic acid anhydride, methylhexahydrophthalic acid anhydride, diphenylsulfonetracarboxylic acid anhydride (DSDA), Anilindimethylether resin (AND-PO), etc.
Inorganic Fillers
The addition of inorganic particles such as ceramic powder, SiO₂, TiO₂, or Al₂O₃ as well as carbon nanotubes to epoxy resins is also an effective agent to improve the heat resistance of epoxy resin adhesives. However, some nanofillers generally require surface modification to significantly increase the thermal decomposition temperature of the composite material.
Heat Stabilizers
In order to improve the high temperature resistance of epoxy adhesives, various stabilizers can be added, such as, for example, antioxidants, thermal stabilizers, and metal ion complexers, including 8-hydroxyquinoline, propyl gallate, resorcin, acetylacetonate metal salts, and arsenic(V) oxide.
Related Products
Formulations for Improving Heat Resistance of Epoxy Adhesives
High-Temperature Resistant Epoxy Sealant Adhesive Formulation
Component | Parts by Mass |
Multifunctional Epoxy Resin | 100 |
Mixed Solvent | 40～80 |
ATBN | 20 |
Additives | Appropriate amount |
Mixed Anhydride Curing Agent | 70～80 |
Coupling Agent | 3 |
Performance and Applications: This adhesive offers excellent resistance to air, water, and oil.
Phenolic-Modified Epoxy Adhesive Formulation
Component | Parts by Mass |
Epoxy Resin | 100 |
Ethylenediamine | 5 |
Phenolic Resin | 45 |
Hexamethylenetetramine | 1 |
Polysulfone Resin Powder | 10 |
Other Additives | Appropriate amount |
Performance and Applications: This adhesive is a high-temperature-resistant adhesive suitable for bonding metals, glass, ceramics, plastics, and other materials.
High-Temperature Resistant Epoxy Sealant Formulation
Component | Parts by Mass |
Bisphenol A Epoxy Resin | 100 |
Multifunctional Epoxy Resin | 40 |
Filler | 40～80 |
Reactive Diluent | 10 |
Additives | Appropriate amount |
Coupling Agent | 3 |
DICY Curing Agent | 10 |
Accelerator (Organic Urea-based) | 2～4 |
Performance and Applications: Offers good heat resistance and bonding strength. Primarily used for bonding materials such as metal, fiberglass, and ceramics, as well as for sealing and bonding under high-temperature conditions.
High-Temperature Resistant Epoxy Adhesive Formulation
Component | Parts by Mass |
Epoxy Resin (690) | 100 |
2,6-Diaminoanthraquinone | 30 |
Bismaleimide | 50 |
Other Additives | Appropriate amount |
4,4'-Diaminodiphenyl Sulfone (DDS) | 30 |
Aerospace-Grade High-Temperature Resistant Epoxy Adhesive Formulation
Component | Parts by Mass |
Tetrafunctional Epoxy Resin (TGDDM) | 100 |
Curing Agent (DDS) | 10–20 |
Polyetherimide (PEI) | 25 |
Other Additives | Appropriate amount |
Performance and Applications: The shear strength of this adhesive at different temperatures is 20.9 MPa (25°C), 19.3 MPa (150°C), and 18.1 MPa (200°C), making it a promising candidate for use in high-tech fields such as aerospace and microelectronics.
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