Polyimide resin (combination with two components) CAS 62929-02-6
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Product Description
Product Details
Description
It is a kind of high temperature resistant polyimide copper clad substrate resin.The performance index of the copper clad is equal to the Arlon 85N series.It can also be used in the manufacturing of high performance composite materials.
Product features
High glass transition temperature and thermal stability;
Excellent solvent resistance;
Low thermal expansion coefficient(Cte,T-axis);
High peel strength of copper foil;
Good storage stability.
Use of the product
100 parts 705-292A and 5.4 parts 705-292B were mixed evenly(the solid content was 60%)and directly used as the matrix resin of high temperature resistant polyimide copper clad plate.
The final performance indicators achieved
Glass transition temperature(Tg) ≥260
Flame retardant(UL-94) HB
Copper foil peeling strength(IBS/In) ≥7
The mechanical properties,thermal stability and electrical properties are equal to 85N system.
Quality indicators
|
Appearance |
Appearance |
Content |
Gelation time（@171℃） |
|
Polyimide resin 29A |
Brownish red viscous liquid |
62% |
200-600s |
|
Polyimide resin 29B |
Light yellow liquid |
23% |
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